Electronic interface apparatus and method and system for manufacturing same

ABSTRACT

A method for manufacture of an electronic interface card ( 100 ) including defining a pair of apertures in a substrate layer ( 116 ), associating an antenna ( 112 ) with the substrate layer ( 116 ) such that opposite ends of the antenna ( 112 ) terminate at the apertures, placing a metal element in each of the apertures, connecting the ends of the antenna to the metal elements, laminating the substrate layer together with a top layer ( 114 ) and a bottom layer ( 118 ), forming a recess ( 122 ) in the top layer and the substrate layer, attaching end of connection wires ( 130 ) to the metal elements, attaching opposite ends of the connection wires ( 130 ) to a chip module ( 120 ) and sealing the chip module in the recess ( 122 ).

FIELD OF THE INVENTION

The present invention relates to electronic interface cards, also knownas “smart cards” generally and more particularly to electronic interfacecards having contact and/or contact-less functionalities.

BACKGROUND OF THE INVENTION

The following U.S. Patents are believed to represent the current stateof the art:

U.S. Pat. No. 7,278,580; U.S. Pat. No. 7,271,039; U.S. Pat. No.7,269,021; U.S. Pat. No. 7,243,840; U.S. Pat. No. 7,240,847 and U.S.Pat. No. 7,204,427.

SUMMARY OF THE INVENTION

The present invention seeks to provide improved electronic interfacecards and methods for manufacturing thereof.

There is thus provided in accordance with a preferred embodiment of thepresent invention, a method for manufacture of an electronic interfacecard including defining a pair of apertures in a substrate layer,associating an antenna with the substrate layer such that opposite endsof the antenna terminate at the apertures, placing a metal element ineach of the apertures, connecting the ends of the antenna to the metalelements, laminating the substrate layer together with a top layer and abottom layer, forming a recess in the top layer and the substrate layer,attaching ends of connection wires to the metal elements, attachingopposite ends of the connection wires to a chip module and sealing thechip module in the recess.

Preferably, the method also includes providing a first additionalsubstrate layer and a second additional substrate layer onto theunderside of the substrate layer prior to the laminating. Additionallyor alternatively, the top layer includes a first top substrate layer anda second top substrate layer. Additionally, the method also includesexposing a recessed surface of the second top layer adjacent the recessand the sealing includes placing an adhesive on an underside of the chipmodule and inserting the chip module into the recess such that theunderside engages the recessed surface.

Preferably, the method also includes folding the wires underneath thechip module. Additionally or alternatively, the method is automated.

Preferably, the attaching ends of connection wires to the metal elementsincludes laser bonding. Additionally or alternatively, the attachingopposite ends of the connection wires to a chip module includessoldering.

Preferably, the wires have a length substantially greater than thedistance between their respective opposite ends in the electronicinterface card.

There is also provided in accordance with another preferred embodimentof the present invention a method for manufacture of an electronicinterface card including forming a substrate having at least one layer,forming an antenna in the at least one layer, forming a recess in the atleast one layer, connecting wires between a chip module and the antennaand mounting the chip module in the recess.

Preferably, the wires have a length substantially greater than thedistance between their respective opposite ends in the electronicinterface card. Additionally or alternatively, the connecting wiresincludes connecting the antenna to metal elements and connecting thewires to the metal elements. Additionally or alternatively, the mountingincluding folding the wires underneath the chip module.

Preferably, the method is automated.

There is further provided in accordance with yet another preferredembodiment of the present invention an electronic interface cardincluding a substrate, a wire antenna associated with the substrate, achip module mounted in a recess formed in the substrate and wiresproviding electrical connections between the chip module and the wireantenna.

Preferably, the chip module includes a packaged smart card chip.Additionally or alternatively, the wires are folded underneath the chipmodule in the recess. Additionally or alternatively, the wires have alength substantially greater than the distance between their respectiveopposite ends in the electronic interface card.

There is still further provided in accordance with still anotherpreferred embodiment of the present invention a system for manufacturingan electronic interface card based on an electronic interface assemblyincluding a substrate having at least one layer, at least two metalelements located in the at least one layer and a wire antenna associatedwith the substrate and having ends electrically coupled to the at leasttwo metal elements, the system including a laminator operative tolaminate the substrate layer together with a top layer and a bottomlayer, a recess former operative to form a recess in the top layer andthe substrate layer, a first wire attacher operative to attach ends ofconnection wires to the metal elements, a second wire attacher operativeto attach opposite ends of the connection wires to a chip module and asealer operative to seal the chip module in the recess.

Preferably, the first wire attacher is a laser bonding wire attacher.Additionally or alternatively, the second wire attacher is a solderingwire attacher.

There is even further provided in accordance with another preferredembodiment of the present invention an electronic interface assemblyincluding a substrate having at least one layer, at least two metalelements located in the at least one layer and a wire antenna associatedwith the substrate and having ends electrically coupled to the at leasttwo metal elements.

There is yet further provided in accordance with yet another preferredembodiment of the present invention a method for manufacture of anelectronic interface assembly including providing a substrate having atleast one substrate layer, associating an antenna with the at least onesubstrate layer and connecting opposite ends of the antenna to metalelements associated with the substrate.

Preferably, the method also includes defining a pair of apertures in asubstrate layer such that opposite ends of the antenna terminate at theapertures and placing the metal elements in each of the apertures priorto the connecting. Additionally or alternatively, the method alsoincludes laminating the substrate layer together with a top layer and abottom layer. Additionally, the method also includes forming a recess inthe top layer and the substrate layer, attaching ends of connectionwires to the metal elements, attaching opposite ends of the connectionwires to a chip module and sealing the chip module in the recess.

Preferably, the attaching ends of connection wires to the metal elementsincludes laser bonding. Additionally or alternatively, the attachingopposite ends of the connection wires to a chip module includessoldering.

Preferably, the method is automated.

There is also provided in accordance with still another preferredembodiment of the present invention an electronic interface assemblyincluding a substrate having at least one layer, at least two terminalslocated in the at least one layer, a wire antenna associated with thesubstrate and having ends electrically coupled to the at least twoterminals, a chip module mounted in a recess formed in the substrate,and wires providing electrical connections between the chip module andthe wire antenna, the wires having a length substantially greater thanthe distance between their respective opposite ends in the electronicinterface assembly.

Preferably, the chip module includes a packaged smart card chip.Additionally or alternatively, the wires are folded underneath the chipmodule in the recess.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be understood and appreciated more fully fromthe following detailed description, taken in conjunction with thedrawings in which:

FIG. 1 is a simplified pictorial and sectional illustration of anelectronic interface card having both contact and contact-lessfunctionalities, constructed and operative in accordance with apreferred embodiment of the present invention;

FIG. 2 is a simplified pictorial illustration of an initial step in themanufacture of the electronic interface card of FIG. 1;

FIGS. 3A and 3B are, respectively, simplified pictorial and sectionalillustrations of a further step in the manufacture of the electronicinterface card of FIG. 1;

FIGS. 4A and 4B are, respectively, simplified pictorial and sectionalillustrations of a yet further step in the manufacture of the electronicinterface card of FIG. 1;

FIGS. 5A and 5B are, respectively, simplified pictorial and sectionalillustrations of a still further step in the manufacture of theelectronic interface card of FIG. 1;

FIGS. 6A and 6B are, respectively, simplified pictorial and sectionalillustrations of an additional step in the manufacture of the electronicinterface card of FIG. 1;

FIGS. 7A and 7B are, respectively, simplified pictorial and sectionalillustrations of a further additional step in the manufacture of theelectronic interface card of FIG. 1;

FIGS. 8A and 8B are, respectively, simplified pictorial and sectionalillustrations of a yet further additional step in the manufacture of theelectronic interface card of FIG. 1;

FIGS. 9A and 9B are, respectively, simplified pictorial and sectionalillustrations of a still further additional step in the manufacture ofthe electronic interface card of FIG. 1; and

FIGS. 10A and 10B are, respectively, simplified pictorial and sectionalillustrations of a final step in the manufacture of the electronicinterface card of FIG. 1.

DETAILED DESCRIPTION OF A PREFERRED EMBODIMENT

Reference is now made to FIG. 1, which illustrates an electronicinterface card 100 having contact and/or contact-less functionalities,constructed and operative in accordance with a preferred embodiment ofthe present invention. As seen in FIG. 1, electronic interface card 100preferably comprises a multiple-layer substrate including top and bottomprotection layers 102 and 104, typically formed of PVC (PolyVinylChloride), each typically of thickness 0.05 mm. Alternatively,protection layers 102 and 104 may be formed of any other suitablematerial, such as Teslin®, PET-G (PolyEthyleneTerephthalate-Glycol),PET-F (PolyEthyleneTerephthalate-Film), polycarbonate or ABS.

Disposed inwardly of both of protection layers 102 and 104 arepreferably artwork layers 106 and 108, typically formed of PVC, eachtypically of thickness 0.15 mm, typically bearing artwork which isvisible through respective protection layers 102 and 104. Alternatively,artwork layers 106 and 108 may be formed of any suitable material, suchas Teslin®, PET-G (PolyEthyleneTerephthalate-Glycol), PET-F(PolyEthyleneTerephthalate-Film), polycarbonate or ABS. Alternatively,artwork layers 106 and 108 may be obviated.

Disposed inwardly of both of artwork layers 106 and 108 there ispreferably provided an inlay 110 including a wire antenna 112,preferably of wire diameter 0.1 mm, embedded in a first inlay layer 114,typically formed of PVC, preferably of thickness 0.15 mm. Inlay 110 alsoincludes second and third inlay layers 116 and 118, also preferablyformed of PVC, of respective thicknesses 0.1 mm and 0.15 mm,respectively. Alternatively, first, second and third inlay layers 114,116 and 118 may be formed of any other suitable material, such asTeslin®, PET-G (PolyEthyleneTerephthalate-Glycol), PET-F(PolyEthyleneTerephthalate-Film), polycarbonate or ABS.

A chip module 120 is mounted in a recess 122 formed in electronicinterface card 100. The chip module preferably includes a packaged smartcard chip 124 having pads 126 and an array 128 of contacts, preferablyof thickness 0.06 mm. Alternatively, contacts 128 may be obviated andsmart card chip 124 may provide contactless functionality.

Electrical connections between the chip module 120 and the embeddedantenna 112 are provided by wires 130, preferably of thickness 0.1 mm,which are preferably soldered at first ends thereof to pads 126 andlaser bonded at opposite ends thereof to metal elements 132 which arebonded to respective ends of wire antenna 112. It is a particularfeature of the present invention that the length of wires 130 betweenpads 126 and respective metal elements 132 is substantially longer thanthe distance between pads 126 and metal elements 132 in the assembledcard. This feature provides enhanced reliability.

A layer 134 of hot melt adhesive, disposed at the periphery of theunderside of array 128 of contacts, retains the chip module 120 inrecess 122, by engaging a corresponding recessed peripheral facingsurface 136 of layer 106.

Reference is now made to FIG. 2, which is a simplified pictorialillustration of an initial step in the manufacture of the electronicinterface card of FIG. 1 in which layer 114 is punched to define a pairof apertures 150. As see in FIGS. 3A and 3B, antenna 112 is associatedwith layer 114, as by known embedding techniques, typically employing anultrasonic head commercially available from PCK Technology, Inc. ofIslip, N.Y., U.S.A. Opposite ends 152 of antenna 112 terminate atapertures 150, as seen in FIGS. 3A and 3B.

Alternatively, antenna 112 may be a printed antenna formed on substrate114 by suitable printing techniques or may be an antenna attached tosubstrate 114 by any suitable attachment method.

Turning now to FIGS. 4A and 4B, it seen that adhesive pads 154 aremounted onto layer 114 at corresponding edges 156 of apertures 150. Asseen in FIGS. 5A and 5B, metal elements 132 are placed in apertures 150and are retained in position therein by adhesive pads 154. Preferablythe ends 152 of antenna 112 are connected to metal elements 132 bythermal-compression bonding or any other suitable technique. Followingthis connecting step, the adhesive pads 154 are no longer needed toretain the metal elements 132 in place and the pads 154 are removed. Itis appreciated that alternatively adhesive pads 154 need not be removed.

At this stage, as seen in FIGS. 6A and 6B, layers 116 and 118 areprovided onto the underside of layer 114 and layers 102, 104, 106 and108 are all laminated together therewith, with the resulting laminatedstructure appearing as shown in FIGS. 7A and 7B.

Turning now to FIGS. 8A and 8B, it is seen that recess 122 is formed inlayers 102, 106 and 114 and metal elements 132 and recessed peripheralfacing surface 136 of layer 106 is exposed, preferably by milling. It isappreciated that alternatively the recess may be formed on the oppositesurface of the card. As seen in FIGS. 9A and 9B, thin wires 130 areattached, preferably by laser bonding, to metal elements 132. The wires130 are trimmed and preferably arranged to extend generallyperpendicularly to layer 102.

Turning now to FIGS. 10A and 10B, it is seen that following attachmentof wires 130 to corresponding pads 126 of the chip module 120, andplacement of hot melt adhesive 134 on the periphery of the underside ofarray 128, the chip module 120 is inserted into recess 122 such that theperiphery of array 128 sealingly engages recessed peripheral facingsurface 136 of layer 106. The insertion method is such that wires 130are folded underneath the chip module 120, as seen in FIG. 1.

It is appreciated that the methodology described hereinabove withrespect to FIGS. 1-10B is preferably highly automated.

It is appreciated that while the illustrated embodiment described hereinincludes substrate layers 102, 104, 106, 108, 114, 116 and 118, themultiple-layer substrate of electronic interface card 100 may includeany suitable number of layers of any suitable thickness.

It is also appreciated that any or all of the layers of the multi-layersubstrate of electronic interface card 100 may be formed of any of thematerials described hereinabove, or any other suitable material, such asa composite material. Additionally, the layers of the multi-layersubstrate of electronic interface card 100 need not be formed of thesame material and each layer may be formed of a different material ordifferent materials.

It will be appreciated by persons skilled in the art that the scope ofthe present invention is not limited by what has been particularly shownand described hereinabove. Rather, the invention includes bothcombinations and subcombinations of the various features describedhereinabove as well modifications and variations thereof which wouldoccur to persons skilled in the art upon reading the foregoingdescription together with the drawings and which are not in the priorart.

The invention claimed is:
 1. A method for manufacture of a chip cardhaving an electronic interface, comprising: defining a pair of aperturesin a substrate layer; associating an antenna with said substrate layersuch that opposite ends of said antenna terminate at said apertures,wherein said associating is performed after said defining; placing ametal element in each of said apertures, wherein said placing isperformed after said associating; connecting said ends of said antennato said metal elements, wherein said connecting is performed after saidplacing; laminating said substrate layer together with a top layer and abottom layer, wherein said laminating is performed after saidconnecting; forming a recess in said top layer and said substrate layerto expose the metal elements in the recess formed, wherein said formingis performed after said laminating; attaching ends of connection wiresto said metal elements exposed in the recess; attaching opposite ends ofsaid connection wires to a chip module; and inserting the chip moduleinto said recess and sealing said chip module in said recess, whereinthe steps of attaching said ends and said opposite ends of saidconnection wires to said metal elements and said chip module,respectively, are carried out while said chip module is positionedcompletely outside of said recess, and wherein each of said connectionwires is a single integral piece and has sufficient length to extendoutside of said recess after said ends of said connection wires areattached to said metal elements and said opposite ends of saidconnection wires are attached to said chip module.
 2. A method accordingto claim 1 and also comprising providing a first additional substratelayer and a second additional substrate layer onto the underside of saidsubstrate layer prior to said laminating.
 3. A method according to claim1 and wherein said top layer comprises a first top substrate layer and asecond top substrate layer.
 4. A method according to claim 3 and alsocomprising exposing a recessed surface of said second top layer adjacentsaid recess and wherein said sealing comprises: placing an adhesive onan underside of said chip module; and inserting said chip module intosaid recess such that said underside engages said recessed surface.
 5. Amethod according to claim 1 and also comprising folding said wiresunderneath said chip module.
 6. A method according to claim 1 andwherein said method is automated.
 7. A method according to claim 1 andwherein said attaching ends of connection wires to said metal elementscomprises laser bonding.
 8. A method according to claim 1 and whereinsaid attaching opposite ends of said connection wires to a chip modulecomprises soldering.
 9. A method for manufacture of an electronicinterface card according to claim 1 and wherein said wires have a lengthsubstantially greater than the distance between their respectiveopposite ends in said electronic interface card.